Dow Corning Releases New LED Package Silicon Sealing Road

On July 10th, Dow Corning's electronics division launched a new silicone encapsulant product, Dow Corning OE-6636, on Thursday (7/9), which is specifically designed to cover the molding process (compression molding) and Developed in the LED package of the dispensing process. The new silicone sealant has a high refractive index of (R) 1.54, which makes it have higher efficiency of light output performance, and has the advantages of low water absorption, effective improvement of heat aging and improvement of optical rotation resistance.
The product also provides better adhesion to general purpose LED package substrate materials. Overlay molding technology is a new trend in LED packaging. Compared with traditional dispensing processes, this technology can increase throughput and can complete hundreds of LED packages at a time.
Dow Corning's new silicon sealant will provide a compatible solution for standard LED package substrates and fabrication technologies. The new product is available in a range of high optical refractive indices and general optical refractive indices to provide excellent light transmission for LEDs in all application wavelength ranges. In addition, the sealant provides excellent protection against stress relief, moisture and UV protection for LED chips.
Kazunori Maruyama, global marketing manager for Dow Corning Electronics, said Dow Corning is a pioneer in the global LED market. With expertise in silicon technology, Dow Corning is pleased to introduce the OE-6636, adding new members to Dow Corning's optical product family and continuing to provide customers with innovative LED packaging technology.

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