Equipped with Infineon XENSIV MEMS microphone: XMOS announces the latest stereo AEC far field linear development kit for Amazon AVS

At the Mobile World Congress, XMOS introduced the VocalFusion™ Stereo Development Kit, specifically designed for Amazon Alexa Voice Service (AVS). This kit marks the first Amazon-certified linear microphone array solution from XMOS, offering far-field performance with stereo acoustic echo cancellation. Earlier in October 2017, XMOS launched the Mono VocalFusion 4 Microphone Development Kit, also certified for AVS. Both kits feature Infineon’s high SNR XENSIV™ MEMS microphone, the IM69D130, ensuring top-tier performance and reliability. Thanks to its collaboration with Infineon, XMOS has developed a range of AVS development kits that outperform competitors in far-field applications. Mark Lippett, President and CEO of XMP, emphasized the value of this partnership, stating, “Infineon’s high-performance microphones enable our kits to deliver superior far-field capabilities. Combined with the XVF3500 voice processor, they create an exceptional user experience.” The IM69D130 XENSIV™ MEMS microphone provides high-quality audio data, making it ideal for use with XMOS’s advanced signal processing algorithms. It offers a remarkable 69 dB signal-to-noise ratio, less than 1% distortion, and a maximum sound pressure level of 128 dB, making it perfect for challenging environments. The new VocalFusion Stereo Development Kit includes the XVF3500 voice processor, which supports full-duplex stereo AEC. It is tailored for developing stereo devices that integrate with Alexa, such as smart TVs, multi-channel sound bars, set-top boxes, and other audiovisual equipment. This kit helps developers create more immersive and responsive voice-enabled experiences.

Embedded PC

An embedded PC is a specialized computer system designed to be integrated into a larger device or system. It is typically smaller in size and lower in power consumption than a traditional desktop or laptop computer, yet it offers a wide range of capabilities and functionality.
Design and Features
Embedded PCs are designed to be highly reliable and durable, as they are often used in industrial, automotive, medical, and other mission-critical applications. They are typically built with solid-state components and have no moving parts, which reduces the risk of failure and increases their lifespan.
These systems are also designed to be compact and lightweight, making them easy to integrate into existing devices or systems. They often have a small form factor and can be mounted on a board or inside a enclosure, depending on the application.
In addition to their small size and reliability, embedded PCs often have a wide range of features and capabilities. They may include processors, memory, storage, and input/output (I/O) interfaces, as well as specialized features such as wireless connectivity, touchscreens, and sensors.

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