Molex, a global leader in complete interconnect solutions, continues to drive the evolution of high-bandwidth communications. With decades of expertise in signal and power integrity, Molex provides critical infrastructure for telecom, aerospace, and data center applications. As China’s telecom market grows rapidly, Molex is well-positioned to support the development of advanced communication systems.
Fischer Huang, Molex’s Global Product Marketing Manager, emphasized the importance of this market: “China’s telecom sector is the largest in the world, and high-end equipment remains a top priority under the 12th Five-Year Plan. Molex’s deep knowledge in end-to-end connectivity helps support the country’s efforts to build robust and scalable networks.â€
In optics, Molex introduces the zQSFP+™ interconnect product—the first QSFP-based solution to deliver over 100Gbps data rates. With a channel rate of up to 25.78Gbps per channel, it enables 100Gb/s Ethernet and InfiniBand applications over distances up to 4km. The system offers excellent cooling, signal integrity, EMI protection, and low power consumption—ideal for high-performance data centers and telecom infrastructures.
On a global scale, Molex’s Optical Fast Conversion Series (QTL) delivers custom-length cable assemblies with fast turnaround times, helping customers meet tight deadlines. This strategy supports rapid infrastructure deployment and accelerates time-to-revenue across the industry.
For design flexibility, Molex offers QTL cable assemblies in custom lengths up to 100 meters, suitable for switches, routers, servers, and more. Meanwhile, the iPass+â„¢ zHD vertical connector system provides a 0.75mm pitch solution for mid-tier applications, supporting SAS-3 and upcoming SAS-4 standards. It enhances airflow and reduces board space constraints while maintaining high-speed performance.
The SpeedStack™ mezzanine connector system offers high-density, low-profile connectivity for data rates up to 40Gbps per differential pair. Available in various configurations, it’s ideal for OEMs with limited PCB space across industries like telecom, military, and medical electronics.
The EXTreme Guardianâ„¢ system, formerly known as EPIC, delivers compact, high-current connectivity with up to 80A per contact. Featuring EMI shielding, hot-plug capability, and UL safety compliance, it suits high-voltage applications in confined spaces.
For even higher current needs, the EXTreme Energetic™ connector system supports up to 100A per column, offering modular designs for flexible configurations. It’s tailored for demanding datacom and power supply applications.
To address signal integrity challenges, Molex’s GbX I-Trac™ backplane connector system minimizes crosstalk and improves impedance control, enabling data transfer rates up to 12.5Gbps. It’s used in backplane, daughter card, and right-angle plug modules, with press-fit options for up to 300 circuits.
For mobile infrastructure, Molex provides MicroTCA solutions that offer cost-effective, scalable connectivity up to 10Gbps. Combining features of ATCA with a compact form factor, MicroTCA ensures high availability and efficient deployment.
Fischer Huang concluded: “As the telecom industry advances, the demand for high-speed, reliable connectivity continues to grow. Molex remains committed to delivering the innovative solutions our customers need to stay ahead.â€
Visit Molex at Booth 3438, E3 Hall, at electronica 2013 to discover the latest in high-end communication connectivity.
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