Molex Releases SpeedStack Connector System

Photocoupler

Molex, a global leader in complete interconnect solutions, has launched the high-density, low-profile, and high-speed SpeedStack mezzanine connector system. Designed for data rates of up to 40 Gbps per differential pair, this innovative system is ideal for OEMs facing space constraints in industries such as military, medical electronics, and consumer devices. With stack heights ranging from 4.00mm to 10.00mm and a 0.80mm pitch, it offers engineers maximum flexibility without compromising performance or airflow efficiency.

Adam Stanczak, Molex’s new product development manager, stated, “There is strong demand for a universal, high-density board-to-board mezzanine solution that saves space, delivers high data speeds, and ensures optimal airflow at low stack heights. The SpeedStack Connector System not only provides a high-speed, low-profile option but also features a narrow enclosure design that allows better air circulation, enhancing cooling performance.”

The SpeedStack connector system comes in various configurations, including 22, 44, 60, 82, 104, and 120 contact counts, with 6 to 32 differential pairs available for greater adaptability. Its 100 Ohm design ensures excellent impedance control. In June 2013, Molex introduced an 85 Ohm version to support PCIe Gen 3.0 and Intel QuickPath Interconnect (QPI) for next-generation I/O and memory signals.

The system features an insert-molded wafer with a shielded enclosure that improves electrical balance and end-position stability. Shared ground pins help reduce crosstalk and enhance overall signal integrity, making it a reliable choice for high-performance applications.