Molex Releases SpeedStack Connector System

Photocoupler

Molex, a global leader in complete interconnect solutions, has launched the high-density, low-profile, and high-speed SpeedStack mezzanine connector system. Designed to support data rates of up to 40 Gbps per differential pair, this advanced system is ideal for OEMs operating in sectors such as military, medical electronics, and consumer devices where PCB space is limited.

The SpeedStack connector features a stack height ranging from 4.00mm to 10.00mm and a pitch of 0.80mm, offering engineers maximum flexibility without compromising on performance or thermal efficiency. Its unique design allows for improved airflow, which enhances cooling capabilities even at low stack heights, meeting the growing demand for compact yet powerful interconnect solutions.

Adam Stanczak, Molex's new product development manager, stated, "The market is looking for a universal high-density board-to-board mezzanine solution that offers space savings, high data rates, and optimal airflow characteristics at low stack heights. The SpeedStack Connector System not only delivers a high-speed, low-profile solution but also incorporates a narrow enclosure design that promotes better airflow and improves system cooling."

The SpeedStack connector system is available in various configurations, including 22, 44, 60, 82, 104, and 120 circuits, with a range of 6 to 32 differential pairs, providing greater design versatility. It features a 100 Ohm impedance control design, ensuring excellent signal integrity. In June 2013, Molex introduced an 85 Ohm model to support PCIe Gen 3.0 and Intel QuickPath Interconnect (QPI) for next-generation I/O and memory signaling.

The system uses an insert-molded wafer design with a protective shielded enclosure that ensures proper end positioning and enhances electrical balance. Shared ground pins help maintain electrical performance and reduce crosstalk, making it a reliable choice for high-speed applications.